Method of manufacturing and using a carrier tape for bonding IC devices

ABSTRACT

A carrier tape has a plurality of rows×a plurality of columns of IC device holes and two pairs of sprocket holes. A plurality of finger leads extending into each IC device hole and a conductive lead for connecting all of the finger leads are formed on the carrier tape. While the carrier tape is conveyed with feed teeth of a sprocket being meshed with one pair of sprocket holes, the finger leads and the conductive leads are formed, and solder is plating on both of the leads. Only in a bonding step, the carrier tape is conveyed with the feed teeth of the sprocket being meshed with the other pair of sprocket holes. Since the sprocket holes used in the bonding step are not deformed, highly precise positioning of IC devices required in bonding can be efficiently achieved. Positioning holes are formed in the carrier tape at intervals corresponding to a plurality of columns of IC device holes, and each processing can be performed for a carrier tape portion between the positioning holes in units of a plurality of columns. The carrier tape can be manufactured with very high efficiency.

This is a division of application Ser. No. 07/332,608, filed Mar. 31,1989.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method of a manufacturing a carriertape for bonding IC devices and a method of using the same.

2. Description of the Related Art

In recent years, a carrier tape for carrying IC devices is known. Thiscarrier tape has sprocket holes formed at predetermined intervals alongthe longitudinal direction in both side edge portions.

The carrier tape is conveyed by a sprocket having feed teeth to bemeshed with the sprocket holes. Each IC device is mounted in an ICdevice hole formed in a central portion of the carrier tape by a TAB(Tape Automated Bonding) system. A conventional carrier tape is conveyedfrom first to final steps with the sprocket holes being meshed with thefeed teeth of the sprocket.

Bonding of an IC device onto the carrier tape requires a good number ofmanufacturing steps. The carrier tape is conveyed by using its sprocketholes in each step. For this reason, if the same sprocket holes are usedfrom the first to final steps as in the case of the conventional carriertape, the sprocket holes deform as the manufacture advances. As aresult, necessary positioning precision cannot be obtained in an ICdevice bonding step which requires highest positioning precision.

SUMMARY OF THE INVENTION

It is, therefore, an object of the present invention to provide acarrier tape capable of maintaining positioning precision required inpredetermined steps.

According to the present invention, there is provided a carrier tape forbonding an IC device, comprising a elongate flexible insulating tapehaving a central portion in which IC device holes are formed toconstitute a matrix of a plurality of rows a plurality of columns, andside edge portions located at both sides of the central portion, aplurality of arrays of sprocket holes being formed at predeterminedintervals along a longitudinal direction of the insulating tape, and aplurality of finger leads having a conductive metal foil, each of thefinger leads being formed on one surface of the insulating tape andhaving a portion projecting inside each of the IC device holes.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a perspective view showing an outer appearance of a carriertape according to the present invention;

FIG. 1B is an enlarged perspective view showing a main part of Fig 1A;

FIG. 2 is a flow chart showing manufacturing steps of the carrier tape;

FIG. 3 is a schematic view of an exposure apparatus for explaining anexposure step;

FIG. 4 is a perspective view showing an apparatus for filling a resistin an IC device hole;

FIG. 5 is a schematic view showing the overall apparatus shown in FIG.4; and

FIG. 6 is a schematic view showing a bonding apparatus.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

An embodiment of the present invention will be described below withreference to the accompanying drawings.

FIG. 1A is a perspective view showing an overall carrier tape accordingto the present invention. A carrier tape 1 is already subjected to abonding step in FIG. 1A, and an IC device 3 is mounted in each IC devicehole 2 as shown in FIG. 1B.

The carrier tape 1 consists of inexpensive polyester or polyimide havingflexibility and an insulating property and has a rather large width. Thecarrier tape 1 has two arrays of sprockets holes 4 and 5, respectively,in each side edge portion and a large number of IC device holes 2 in itscentral portion. The two arrays of the sprocket holes 4 and 5,respectively, are arranged parallel to each other, and the holes 4 and 5are formed at predetermined intervals along the longitudinal direction(of the carrier tape 1). In this case, each sprocket hole 4 arrangedoutside is a circular hole, and each sprocket hole 5 arranged inside isa square hole. A plurality of rows of IC device holes 2 extend in thelongitudinal direction of the carrier tape 1 and are arranged atpredetermined intervals across the widthwise direction of the carriertape 1. As shown in FIG. 1B, the IC device 3 is mounted in each ICdevice hole 2. The IC devices 3 are arranged at a lower side of thetape 1. Electrodes (not shown) of each IC device 3 are bonded to fingerleads 7 which are formed on the upper surface of the tape 1 and extendedto the inside of the IC device hole 2. The finger leads 7 are formed byetching a copper foil laminated on the upper surface of the tape 1. As aresult of this etching, row and column leads 8 are simultaneously formedin a matrix, and a pair of row leads 8 located at both of the sides ofthe carrier tape 1 are formed wider than the other leads 8. All of thefinger leads 7 connected to a single IC device 3 are surrounded by andelectrically connected to pairs of column and row leads 8. When tin- orsolder-plating is to be performed on the finger leads 7, leads 8 areused to apply a ground potential for plating to each finger lead 7. Thematrix copper foil leads 8 are continuously formed as a whole. Thefinger leads 7 of each IC device 3 are connected to the leads 8.

In addition to the sprockets holes 4 and 5, the fast setting holes (ormarks) 9 are formed in both side edge portions of the carrier tape 1.The holes 9 are formed for every plurality of columns (F columns) of theIC devices 2. The columns extend in the widthwise direction of thecarrier tape 1.

The carrier tape 1 having the above arrangement according the thisembodiment is manufactured by steps (a) to (k) shown in FIG. 2. In apress step (a), the two arrays each of the sprocket holes 4 and 5, theIC device holes 2, and the fast setting holes 9 are formed. The ICdevice holes 2 are partially omitted in FIG. 1A, but an IC device hole 2is formed in each matrix copper pattern 8. The carrier tape 1 in whichpredetermined holes are formed in the press step (a) is conveyed to acopper foil laminating step (b). In the laminating step, a copper foilfor forming the finger leads 7 and the copper foil to leads 8 on theupper surface is laminated. The tape 1 subjected to the copper foillaminating step (b) is conveyed to photoresist coating step (c), and aphotoresist is coated on the copper foil. The tape 1 subjected to thephotoresist coating step (c) is conveyed to an exposure step (d). Inthis step, light is radiated on the photoresist to expose patterns ofthe finger leads 7 and the copper foil to leads 8. Note that theexposure step (d) will be described in detail below. The carrier tape 1is then conveyed to a developing step (e). In this step, developing isperformed to form a predetermined image (patterns) of the finger leads 7and the copper foil to leads 8.

The tape 1 subjected to the developing step (e) is conveyed to a devicehole filling step (f). In this step, an etching resist is filled in theIC device holes 2 from the lower surface side of the tape 1 to coverportions of the copper foil (laminated on the carrier tape in the copperfoil laminating step (b)) corresponding to the IC device holes 2, sothat portions of the finger leads 7 extending inside the holes 2 can becorrectly etched. The device hole filling step (f) will be described indetail below. The carrier tape 1 subjected to the device hole fillingstep (f) is conveyed to an etching step (g). In this step, etching isperformed to remove the copper foil except for the image (the fingerleads 7 and the copper foil patterns 8) developed in the developing step(e). The tape 1 subjected to the etching step (g) is conveyed to aresist removing step (h). In this step, the etching resist filled in thedevice hole filling step (f) is removed. The tape 1 is conveyed to aplating step (i). In this step, tin or solder is plated to the fingerleads 7. The carrier tape 1 is then conveyed to bonding step (j). Inthis step, electrodes (not shown) of the IC device 3 located below eachIC device hole 2 are bonded to the finger leads 7. In this manner, theIC devices 3 are mounted on the carrier tape 1. The bonding step (j)will be described in detail below. The carrier tape 1 mounting the ICdevices 3 as shown in FIG. 1A is conveyed to a cutting step (k). In thisstep, each IC device 3 is cut from inside the copper foil to leads 8,thereby manufacturing a large number of IC units.

The carrier tape 1 is conveyed from the press step (a) to the bondingstep (j) by a sprocket having feed teeth to be meshed with one type ofsprocket holes (in this case, the circular sprocket holes 4) formed ineach side edge portion. In the bonding step (j), the tape 1 is conveyedby a sprocket having feed teeth to be meshed with the other sprocketholes (in this case, the square sprocket holes 5). The reason forswitching the sprocket holes in the bonding step (j) from those used inconveyance between the copper foil laminating step (b) and the platingstep (i) is as follows. That is, if the carrier tape 1 consists of amaterial which easily deforms, the sprocket holes deform with a highprobability before the plating step (i). When the carrier tape isconveyed by using the deformed sprocket holes in the bonding step (j)requiring high positioning precision, positioning cannot be correctlyperformed. For this reason, unused sprocket holes without deformationare used in the bonding step (j) to obtain high precision.

In each of the copper foil laminating step (b), the developing step (e),the etching step (g), the resist removing step (h), and the plating step(i), positioning is not performed (normally, the carrier tape issandwiched and conveyed by a pair of rollers without using either thesprocket holes 4 or 5), and processing can be performed while thecarrier tape is conveyed. For this reason, a processing speed isunconditionally determined by performance of each processing apparatus.In each of the press step (a), the photoresist coating step (c), theexposure step (d), and the device hole filling step (f), however, thecarrier tape must be temporarily stopped to be positioned in order toperform each step. In a conventional system, each of the aboveprocessing steps is performed by conveying the sprocket holes 4 in unitsof columns, resulting in a very low processing efficiency.

In this embodiment, therefore, each processing step is performed inunits of a plurality of columns (to be referred to as a plural columnunit processing hereinafter), thereby significantly increasing theefficiency.

That is, the fast setting holes (or marks) 9 are formed in both sideedge portions of the carrier tape 1. The fast setting holes 9 are formedin units of a plurality of columns (F columns) of the IC device holes 2.Upon positioning, the holes 9 are detected by a sensor. That is, when apredetermined processing is completed for F columns, the sprockets isrotated at high speed by a servomotor (not shown) to convey the carriertape 1. When the next tape feed setting holes 9 are detected by thesensor, rotation of the sprockets are stopped to position the tape 1,and the processing is repeatedly performed for next F columns. In thismanner, the plural column unit processing is executed. So, in thisembodiment, 10 rows×9 columns=90 IC devices are processed at the sametime, and positioning need to be performed only once for each 90 ICdevices.

As an example of this operation, the exposure step (d) will be describedin detail below with reference to FIG. 3.

Referring to FIG. 3, an exposure apparatus 10 comprises a light sourcelamp 12, an X-Y-θ table 13, and a TV camera (sensor) 14 in an apparatusmain body 11. The light source lamp 12 located in an upper portion ofthe main body 11 and the X-Y-θ table 13 located in its central portionare arranged horizontally with respect to the main body 11. The TVcamera 14 located in a lower portion of the main body 11 is obliquelyarranged with respect to the main body 11 so as to detect a centralportion of the X-Y-θ table 13. The X-Y-θ table 13 employs a mask 16 inan opening portion 15. The mask 16 has a size and a feature forprocessing 10 rows×9 columns=90 IC devices 3 at the same time asdescribed above. The X-Y-θ table 13 can move in the X, Y, and θdirections. Position detection for the IC device holes 2 of the carriertape 1 is performed by another TV camera (not shown). While any positiondeviation of the tape 1 are found, the table 13 is moved in a suitabledirection to perform positioning.

The carrier tape 1 subjected to the photoresist coating step (c) inwhich the photoresist is coated on the copper foil is wound around areel 17 and mounted on a tape supply shaft 18. The tape 1 passes betweenthe X-Y-θ table 13 and the TV camera 14 in the exposure apparatus 10 andis taken up by a reel 20 mounted on a tape take-up shaft 19.

The carrier tape 1 set as described above is conveyed by sprockets 21and 22 located at both sides of the apparatus 10. In this case, feedteeth 21a and 22a of the sprockets 21 and 22, respectively, mesh withthe circular sprocket holes 4.

When the sprockets 21 and 22 rotate in an arrow direction, the carriertape 1 is taken up by the reel 20 to move in the exposure apparatus 10.When the TV camera 14 recognizes (detects) the next of the fast settingholes 9 upon conveyance of the tape 1, the sprockets 21 and 22 arestopped, and the tape 1 is positioned in the apparatus 10. The lightsource lamp 12 is turned on to radiate the UV-light to the mask 16 inthe X-Y-θ table 13 as indicated by arrows. The plural column unitprocessing is executed by this UV-light radiation. In this embodiment,the photoengraving of the finger leads 7 and the copper foil patterns 8for 90 IC devices are executed. The plural column unit processing can besimilarly performed in any of the above steps.

Processing performed in the device hole filling step (f) and anapparatus for executing this step will be described below. This step isexecuted by the above plural column unit processing.

FIG. 4 shows an arrangement of main part of an etching resist supplyapparatus, and FIG. 5 shows the etching resist supply apparatus.

Sprockets 31 and 32 for conveying the carrier tape 1 are located at bothsides of the apparatus 30. A tape supply shaft 33 and a tape take-upshaft 34 are located outside the sprockets 31 and 32, respectively. Areel 35, for winding the developed carrier tape 1 such that the lowersurface of the tape faces up, is mounted on the tape supply shaft 33.The carrier tape 1 wound around the reel 35 is supplied in the etchingresist supply apparatus 30 and taken up by a reel 36 mounted on the tapetake-up shaft 34. In this case, feed teeth 31a and 32a of the sprockets31 and 32, respectively, mesh with the circular sprocket holes 4 of thetape 1. When the sprockets 31 and 32 rotate in an arrow direction, thecarrier tape 1 set as described above is taken up by the reel 36 andconveyed in the etching resist supply apparatus 30. When a TV camera 37located obliquely in the apparatus 30 recognizes (detects) the next ofthe fast setting holes 9 upon conveyance of the tape 1, the sprockets 31and 32 are stopped by an output from the camera 37, and the tape 1 ispositioned in the apparatus 30. At this time, 10 rows×9 columns=90 ICdevice holes 2 are set as objects to be processed.

The etching resist supply apparatus 30 comprises, in its apparatus mainbody 38, an etching resist filling table 39, a smoothening member 40, anetching resist transfer table 41, and the TV camera 37, as shown inFIGS. 4 and 5.

The etching resist filling table 39 sequentially stores, in theapparatus main body 38, an etching resist to be supplied in the ICdevice holes 2 of the carrier tape 1. A rectangular base portion 42 inwhich the etching resist is filled is formed at a head portion of thetable 39. The upper surface of the base portion 42 is horizontal, and aplurality of parallel elongated grooves 43 are formed in the overallupper surface. The number of elongated grooves 43 corresponds to thenumber of rows of the IC device holes 2 formed in the widthwisedirection of the carrier tape 1. The width of the groove 43 is equal tothe longitudinal size of each IC device hole 2. A hollow post 44 isconnected to the base portion 42. An etching resist (solution) issupplied from inside the post 44 into the base portion 42 by a pump (notshown). The etching resist (solution) is injected from the post 44 intothe base portion 42 and filled in the elongated grooves 43. The etchingresist filling table 39 having the above arrangement is located at aposition out of a passing position of the carrier tape 1 in theapparatus main body 38.

The smoothening member 40 is located above the table 39 and smoothensthe surface of the etching resist filled in the base portion 42 of thetable 39. Each time the etching resist is filled in the base portion 42,an inclined sliding plate 46 which is reciprocated along guide member 45slides on the upper surface of the base portion 42, thereby smootheningthe surface of the filled etching resist.

The etching resist transfer table 41 is located above the smootheningmember 40 and fills the etching resist filled in the base portion 42 ofthe etching resist filling table 39 into the IC device holes 2 of thecarrier tape 1. The transfer table 41 includes a large number ofprojecting transfer bases 48 arranged in a matrix manner atpredetermined intervals on the lower surface of a rectangular main body47. The number of transfer bases 48 corresponds to the number (in thisembodiment, 10 rows×9 columns=90) of IC devices to be processed when theplural column unit processing is performed for the carrier tape 1. Thesize of each transfer base 48 corresponds to the IC device hole 2. Whenthe carrier tape 1 is positioned in the etching resist supply apparatus30 as described above, the etching resist transfer table 41 descendsuntil the transfer bases 48 are brought into contact with the surface ofthe etching resist filled in the elongated grooves 43 in the base 42 ofthe etching resist filling table 39, and the etching resist in thegrooves 43 is transferred to the lower surfaces of the correspondingtransfer bases 48. At this time, in order not to interfere with avertical movement of the transfer table 41, the smoothening member 40 ispositioned such that its sliding plate 46 is located at the side of thebase portion 42 as shown in FIG. 4. This position is a home position ofthe member 40. The transfer table 41 moves upward to a home position atwhich the transfer bases 48 on which the etching resist adheres islocated slightly above the carrier tape 1. Subsequently, the transfertable 41 horizontally moves to a position above the carrier tape 1 andthen descends to fill the etching resist adhered on the transfer bases48 into the IC device holes 2. In this case, since the etching resistadhered on the transfer bases 48 is transferred into the IC device holes2, the filled etching resist is flat and has a predetermined thickness.For this reason, a required drying time can be shortened, and amaintenance of drying step can be easily performed. In addition, since aplurality of (in this case, 90) IC device holes 2 can be simultaneouslyfilled, filling processing of the IC device holes 2 can be performedwith high efficiency.

After the predetermined filling processing is performed by the etchingresist supply apparatus 30 as described above, the carrier tape 1 isconveyed again by the sprockets 31 and 32, and 90 IC device holes 2 tobe processed next are positioned in the apparatus 30.

In the above embodiment, a plurality of elongated grooves 43 are formedin the upper surface of the base portion of the etching resist fillingtable 39. The base portion 42, however, may be a simple recess portionhaving an open upper surface without forming the elongated grooves 43.

The bonding step (j) will be described below in detail with reference toFIG. 6.

A bonding apparatus 50 used in this step comprises a heater chip 53which can move along the widthwise direction of the carrier tape 1 andcan finely move along its longitudinal direction, and a TV camera 54 forreading a wiring pattern (finger leads 7) of the tape 1 from a positionabove and aside the heater chip 53. When the heater chip 53 is notproperly positioned to the wiring pattern, the chip 53 is finely movedin the longitudinal direction to correct the position.

The carrier tape 1 subjected to the plating step (i) in which plating isperformed for the finger leads 7 is wound around a reel 55 and mountedon a tape supply shaft 56. The tape 1 passes under the heater chip 53and is taken up by a reel 58 mounted on tape take-up shaft 57. The tape1 set as described above is conveyed by sprockets 51 and 52 located atboth sides of the bonding apparatus 50. In this case, feed teeth 51a and52a of the sprockets 51 and 52 mesh with the square sprocket holes 5.

When the sprockets 51 and 52 rotate in an arrow direction, the carriertape 1 is taken up by the reel 58 and conveyed under the heater chip 53.In this bonding step, one column of IC devices is processed at once. Forthis reason, when the tape 1 is conveyed by a distance corresponding toone column of IC devices, the sprockets 51 and 52 are stopped. After theunbonded column is positioned under the heater chip 53 in this manner,the TV camera 54 reads this positioned state. As described above, whenthe heater chip 53 is not properly positioned to the finger leads 7, thechip 53 is finely moved in the longitudinal direction of the carriertape 1 to correct the position. When the positions of the chip 53 andthe finger leads 7 coincide with each other in this manner, the heaterchip 53 moves in the widthwise direction to sequentially bond the ICdevices 3 set under the IC device holes 2 of the column. When bonding ofthe column is completed, the sprockets 51 and 52 rotate again to conveythe carrier tape 1, thereby positioning the next row under the heaterchip 53.

When bonding is performed as described above, even if the carrier tape 1consists of a resin film such as a polyester film which easily deforms,the tape 1 can be positioned under the heater chip 53 with highprecision because it is conveyed by using the sprocket holes 5 not usedin the previous steps.

What is claimed is:
 1. A method of manufacturing a carrier tape,comprising the steps of:perforating IC device holes arranged in a matrixof a plurality of rows×a plurality of columns in a central portion of anelongate insulating tape and perforating a plurality of arrays ofsprocket holes along a longitudinal direction of said insulating tape inboth side edge portions thereof; attaching a metal foil having a widthcorresponding to at least said central portion of said insulating tapeto one surface of said insulating tape; coating a photoresist on saidmetal foil; exposing said photoresist by using a mask havingpredetermined patterns; filling an etching resist in said IC deviceholes; forming a first matrix conductive lead surrounding said IC deviceholes and a plurality of finger leads connected to said first conductivelead and projecting inside one of said IC device holes by removing saidphotoresist and said metal foil in reverse; and plating said firstconductive lead and said finger leads.
 2. A method according to claim 1,wherein said elongate insulating tape comprises of a polyester orpolyimide.
 3. A method according to claim 1, wherein in said fillingstep, the etching resist is simultaneously filled in a plurality ofcolumns of IC device holes.
 4. A method according to claim 1, whereinsaid perforating step includes a step of forming mark means forpositioning every plurality of columns of said IC devices in saidinsulating tape.
 5. A method according to claim 4, wherein at least oneof said coating step, said exposing step, and said filling step includesa process to be proceeded at the same time for a portion between saidmark means of said insulating tape upon once positioning of said formingmark means.
 6. A method according to claim 1, wherein said forming stepincludes a step of forming a second conductive pattern on each sideportion of said insulating tape along a longitudinal direction of saidinsulating tape.
 7. A method of bonding a carrier tape, comprising thesteps of:perforating at least two pairs of sprocket holes in both sideedge portions of an elongate flexible insulating tape along alongitudinal direction thereof; forming a plurality of connection leadsfor defining a plurality of rows×a plurality of columns of IC deviceconnection portions, while conveying said insulating tape with feedteeth of a sprocket being meshed with one of said two pairs of sprocketholes, one end of each of said connection leads extending into acorresponding one of said IC device connection portions, forming aconductive lead for connecting all of said connection leads, and platingsaid connection leads and said conductive lead; and positioning andbonding one end of each connection lead arranged at each IC deviceconnection portion to an electrode of an IC device while conveying saidinsulating tape with the feed teeth of said sprocket being meshed withthe other pair of said sprocket holes.
 8. A method according to claim 7,wherein said insulating tape comprises either one of a polyester andpolyimide.